摘要
为了降低塑封半导体器应用于高可靠性产品领域中的质量风险,采用质量细化分析方法,针对塑封半导体器件本身在材料、结构等方面的特点,做了塑封半导体器件失效模式与机理的原理探讨。得出器件应用于产品前,应该进行温度适应性评估、二次筛选以及破坏性物理分析等先期工作。
In order to reduce the application risk of the plastic semiconductor components used in the field of high-reliability products,the method of detailed analysis of quality is adopted,aiming at the material and structure characteristics of semiconductor components,some failure modes and principles of plastic semiconductor components are discussed.The conclusion is as follows：before the semiconductor components are applied to products,the temperature adaptability evaluation,the secondary screening and destructive physical analysis should be conducted.
出处
《现代电子技术》
2010年第16期164-165,174,共3页
Modern Electronics Technique
关键词
塑封半导体器件
可靠性
温度适应性评估
二次筛选
破坏性物理分析
plastic semiconductor component
reliability
temperature adaptability evaluation
secondary screening
destructive physical analysis
