摘要
半固化片激光分条,是一种可以彻底解决长期以来困扰线路板行业的PP粉污染问题的新工艺。该工艺采用激光等光、机、电一体化控制技术,实现卷状PP(Prepreg,或者半固化片)料的分条。该工艺不产生PP粉,自动封边,同时,解决PP粉在压合制程中带来的凹陷问题,满足PCB行业的生产需求。
PP Laser Cutting is the new technics of thoroughly resolving contaminated problem of PP powder in PCB trade long term. The technics has adopted the modem technology of laser, mechanism and electric. It can cut the rolled prepreg without PP powder and overhand the edge automatically, at the same time, resolve the sunken problem in laminating. So it can satisfy manufacture in PCB industry.
出处
《印制电路信息》
2010年第1期66-68,共3页
Printed Circuit Information
关键词
PP激光分条
PP粉
凹陷
PP Laser Cutting
PP powder
sunken problem
