摘要
通过对高性能环氧树脂进行降低流动性等特殊改性研究,开发出一种综合性能优良的不流动半固化片(No-Flow Prepreg),并成功通过了刚挠结合印制板厂家的试用及一系列严格考察评估。该产品从2007年下半年开始向市场推广,经多个厂家的批量生产使用,结果显示No-Flow Prepreg产品综合性能优良,使用质量稳定,达到国外同类产品的水平。
Through sophisticated low-flow modification with the applications of epoxy resins, we developed the high performance No-Flow Prepreg, which has passed a series of most stringent evaluation tests conducted by rigidflex PCB customers, This product has been promoted in market since mid 2007, and ever since several customers have used a few quantity of this product to fabricate Rigid-Flex PCB. It turned out that this No-Flow Prepreg has good properties and consistent quality, which attained foreign counterpart＇s level.
出处
《印制电路信息》
2008年第3期22-24,共3页
Printed Circuit Information
关键词
不流动
低流动
半固化片
阶梯板
刚挠性印制板
no-flow
low-flow
bonding sheet/prepreg
die cavity board
rigid-flex PCB
