摘要
由于硫脲的分子结构特点,且与贵金属有着特殊亲合力,其在电镀工业中有着广泛的应用。总结了硫脲在电镀和化学镀工艺中的应用。硫脲作为配位剂可用于化学镀,退除不良镀层和电镀贵金属;同时作为稳定剂可用于化学镀镍、铜、镍磷合金和浸锡;而且还可作为特殊添加剂应用于电镀锌、铜、镍、镉、锌锰和铜金合金等;此外还论述了硫脲使用的局限性及目前存在的问题的解决方法。
A review is provided of the application of thiourea in electroplating and eJectroless plating. It is pointed out that thiourea has been widely used in electroplaing industry, owing to its special molecular structure and affinity to precious metals. Namely, as a kind of complexing agents, thiourea can be used for electroless plating, removing coating with poor adhesion and defects, and electroplating precious metals. At the same time, thiourea as a stabilizing agent can be used for electroless plating of nickel, copper, nickel phosphor alloy, and tin dipping. And it can also be used as a special additive for electroplating zinc, copper, nickel, cadmium, zinc manganese alloy, and copper gold alloy. In addition, the disadvantages of thiourea and countermeasures to overcome them are stated.
出处
《材料保护》
CAS
CSCD
北大核心
2008年第12期50-53,共4页
Materials Protection
关键词
硫脲
电镀
配位剂
稳定剂
应用
thiourea
electroplating
complexing agents
stabilizing agents
application
