摘要
铜的性质决定了铜在工业应用中的重要性,特别是目前在微电子工业中的决定性作用,使铜的电沉积过程成为研究热点。结合铜在微电子工业中的应用,综述了硫酸盐镀铜中铜的电沉积机理、铜镀层微结构、添加剂对铜电沉积过程的影响以及铜电沉积初期行为方面的研究进展。指出了铜电沉积未来的研究方向。
A review is given on the electrodepositing mechanism of copper from sulfate bath and on the microstructure of the copper coating, the effect of additives on the electroplating process, as well as the research progress concerning copper electrodepositing. It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance. Moreover, the future aspects in the research of electroplating copper are suggested as well.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第1期44-47,共4页
Materials Protection
关键词
电沉积
铜
硫酸盐体系
electrodeposition
copper
sulfate system
