期刊文献+

硫酸盐镀铜的故障分析及修复 被引量:1

Trouble-Shooting Technology for Copper Electroplating from Sulfate Bath
下载PDF
导出
摘要 依据"HullCell"和小槽试验以及对数家电镀厂多年的研究发现,硫酸铜镀层出现的表面缺陷、目视样板对比的光泽性较差或外观色泽不当、电沉积层覆盖能力不强等弊病,主要是由电镀生产管理不善、电镀液维护及添加试剂错误等造成的。针对电镀生产中典型的硫酸铜故障及电镀液经常出现的问题和镀层出现的缺陷,进行了多次试验和分析,并提出了相应的故障修复技术和电镀液维护措施。 Based on the'Hull Cell'experiments and investigation of many years and research in some electroplating plants,it was found that the surface defects,poor glossiness in visual mould boards or abnormal visual brightness and lower electrolytic depositional covering capacity in copper sulfate plating were attributed to the mistakes in electrolyte maintenance and unsuitable additives caused by inappropriate electric plating plant supervision.In view of the typical inactions in electroplating production,the problems encountered in electrolyte,and the flaws in plating,proper trouble-shooting strategies for electric copper plating and electrolyte maintenance were offered after repeated experiments and careful ly comprehensive analysis.
出处 《材料保护》 CAS CSCD 北大核心 2007年第7期67-69,共3页 Materials Protection
关键词 电镀 硫酸盐镀铜 故障处理 电解液维护 electroplating copper electroplating from sulfate bath trouble shooting electrolyte maintenance
  • 相关文献

参考文献8

二级参考文献36

  • 1曾华梁 吴仲达.电镀基本原理与实践[M].机械工业出版社,1986.. 被引量:5
  • 2曾华梁 等.电镀工艺手册[M].机械工业出版社,1991.. 被引量:7
  • 3《电镀手册》编写组.电镀手册(上)[M].国防工业出版社,1986.733. 被引量:1
  • 4Puippe J G, Acosta R E, Von Guttfeld R J. Investigation of laser-enhanced electroplating mechanisms[J]. Journal of the electroplating society, 1981, 128(12); 2539-2545. 被引量:1
  • 5Jae Jeong Kim, Soo-Kil Kim, Jong-Uk Bae. Investigation of copper deposition in the presence of benzotriazole[J]. Thin Solid Films, 2002, 415(1):101-107. 被引量:1
  • 6Yoon S, Schwartz M, Nobe K. Rotating ring-disk electrode studies of Cu anodes: effect of chloride ions and organic additive[J]. Plating and Surface Finishing, 1995, 82(2):64-69. 被引量:1
  • 7Yoon S, Schwartz M, Nobe K. Rotating ring-disk electrode studies of copper electrodeposition : effect of chloride ions and organic additives[J]. Plating and Surface Finishing, 1994, 81(12):65-73. 被引量:1
  • 8Reinchenbach D. Testing of copper plating by rotating cone electrode[J]. Plating and Surface Finishing, 1994, 81(5):106-109. 被引量:1
  • 9Cope B P, Harrover R E, JR, et al. Acid copper addition agent[P]. US Pat: 2972572, 1958-12-09. 被引量:1
  • 10Wennemar Strauss, Wolf-Dieter Willmund, Dusseldof-Holthausen, et al. Baths for the production of copper electroplates[P]. US Pat: 3051634,1962-08-28. 被引量:1

共引文献23

同被引文献5

引证文献1

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部