摘要
介绍了电子封装中10种电镀常见缺陷,包括漏镀、厚度不足、锡皮、毛刺、起皮、烧焦、变色、沾污、可焊性差和发花。分析了造成这些缺陷的主要原因。
Ten common plating defects in electronic packaging were introduced, including skip plating, thickness insufficiency, excessive tin deposit, burr, exfoliation, burning, tarnishing, contamination, poor weldability and haziness. The main reasons for these defects were analyzed.
出处
《电镀与涂饰》
CAS
CSCD
2008年第8期21-23,共3页
Electroplating & Finishing
关键词
电子封装
电镀
缺陷
原因
electronic packaging
plating
defect
cause
