摘要
开发无铅化纯锡电镀技术必须首先解决锡须问题。讨论了锡须形成的影响因素及机理。开发出一种能有效防止锡须生成的无铅纯锡电镀添加剂,该添加剂具有结晶细致、可焊性好、消耗量低、使用维护容易等优点,从而建立了一种抑制锡须的有效方法,同时解决了纯锡电镀中的其它难题。介绍了控制锡须的其它一些有效措施及锡须生长加速试验。
Whisker problem must be firstly solved in developing a lead-free pure tin electroplating process. The affecting factors and mechanism of whisker forming were discussed. An additive for lead-free pure tin electroplating that can effectively prevent whisker forming was developed, which has advantages of fine crystal, good solderability, low consumption, easy operation, etc. And thereby an effective method for controlling whisker forming as well as the solutions for other difficult problems in pure tin electroplating was presented. Some other effective measures for controlling whisker forming and the accelerated test of whisker formation were also introduced.
出处
《电镀与涂饰》
CAS
CSCD
2005年第3期44-46,共3页
Electroplating & Finishing
关键词
无铅纯锡电镀
锡须
添加剂
lead-free pure tin electroplating
tin whisker
additive
