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Pyrex玻璃与Kovar合金阳极键合界面微观结构及其形成机制 被引量:8

Microstructure and bonding mechanism of anodic bonded interface between pyrex glass and kovar alloy
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摘要 在温度300~500℃、电压400~650V、时间10~20min的阳极键合工艺条件下,Pyrex玻璃与Kovar合金可实现快速连接;采用高分辨扫描电镜、超轻元素能谱仪、透射电镜及X射线衍射仪分析了接合区微观组织、微区化学成分、界面微区相结构等。结果表明,Pyrex玻璃与Kovar合金的结合过程分为三个阶段,即界面极化及静电吸附阶段,离子迁移及阳极氧化阶段,氧化物固相扩散结合及过渡区形成阶段;界面静电力及离子扩散迁移为界面结合的物理化学反应提供了必要条件;Pyrex玻璃与Kovar合金连接区由玻璃—过渡区—金属构成,过渡区的主要结构是尖晶石氧化物,其化学成分及致密度对接头强度具有较大影响。 Under the condition of technological parameters of anodic bonding,the temperature in range of 300-500 ℃,the voltage in range of 400-650 V,and time being 10-20 min,Pyrex glass and Kovar alloy can be quickly joined.By means of the high resolution scanning electron microscope,super-light element spectrometer,transmission electron microscope and X-ray diffraction instrument,the microstructure of joined interface,tiny area chemical composition,phase structure of tiny area of interface were analyzed.The results indicated that the joining process of Pyrex glass and Kovar alloy can be divided three stages:interface polarization and electrostatic adsorption stage,the ion transferring and anodic oxidation stage,oxide solid phase diffusing or union and transition region formed stage.Interface electrostatic force and ion diffusing or motion provide requirement for the physical chemistry reaction of the interface combining.The joint of Pyrex glass and Kovar alloy is composed of glass-transition region-metal,and the main structure of transition region is spinel oxide,and chemical composition and its compactible degree has quite great effect on joint strength.
出处 《焊接学报》 EI CAS CSCD 北大核心 2008年第2期73-76,共4页 Transactions of The China Welding Institution
基金 国家自然科学基金(50375105),(50671070)资助项目
关键词 玻璃 可伐合金 阳极键合 连接界面 微观结构 Pyrex glass Kovar alloy anodic bonding joined interface microstructure
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  • 1韩强.对玻璃与金属封装外壳气密性的认识[J].电子与封装,2003,3(1):49-52. 被引量:11
  • 2胡君遂,堵永国,陈文莉,唐珍兰.封接工艺对玻璃与可伐合金结合性能的影响[J].机电元件,2005,25(2):37-40. 被引量:13
  • 3太阳能联盟网.太阳能光热进入产业"千亿"元年[EB/OL].http://www.cstif.2ltyn.com/news/echo.php?id=19320,2010-08-15/2009-12-24. 被引量:1
  • 4Donald I.W.Preparation,properties and chemistry of glass and glass-ceramic-to-metal seals and coati ngs[J].Journal of materials science,1993,28:2841-2886. 被引量:1
  • 5Briand.D,Weber.P.,?de Rooij N.F.Metal to glass anodic bonding for Microsystems packaging[J].TRANSDUCERS'03.12th International Conference on SolidState Sensors,Actuators and Microsystems.Digest of Technical Papers (Cat.No.03TH8664),2003,2:1824-7. 被引量:1
  • 6Vargo,Green,Mueller,Bame.Characterization of KovarPyrex anodically bonded samples-a new packaging approach for MEMS devices[J].Proceedings of SPIE-The International Society for Optical Engineering,2000,4180:76-83. 被引量:1
  • 7邱爱叶.超真空技术[M].浙江:浙江大学出版社,1991:1-5. 被引量:1
  • 8张成俊,S1.可伐合金膨胀系数的回归方程和封接结合机理.上海钢研,1982,. 被引量:1
  • 9FactSage.The Integrated Thermodynamic Databank System[EB/OL].http://www.factsage.cn,2010-08-16/2010-07-16. 被引量:1
  • 10Sasaki,S.Radial distribution of electron density in magnetite,Fe304[J].Acta Crystallographica B,1997,53:762-766. 被引量:1

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