摘要
采用正交试验方法研究了封接工艺对玻璃与可伐合金结合性能的影响。利用电子万能实验机和金相法分别测试了封接件的剪切强度和显微组织。结果表明:在封接工艺过程中,封接气氛(N2流量)是最主要的影响因素,封接温度次之,封接时间的影响最小。
Influence of the sealing process between the glass and kovar on the bonding propertieswas studied by orthogonal testing method. By means of the electronic universal testing machine and the granularity analyzer, the paper studied the bonding strength and structure of the glass-to-kovar. The results show that the flux of N2 was an important factor to the quality of the sealing. The sealing temperature was the second important factor and the sealing time was the third.
出处
《机电元件》
2005年第2期37-40,共4页
Electromechanical Components
