摘要
为了制备高导电性电磁屏蔽材料,对玻璃纤维和3种不同粒度(400,1000,2500目)的SiO2微粒表面的化学镀银工艺进行了研究,并对镀层表面状况及镀银产品的导电性进行了测试。结果表明:所用镀银液配方合理;镀银玻璃纤维表面镀层均匀,镀层与基底材料结合牢固。SiO2粒度对镀层质量影响很大,当粒度达400目时,表面镀银层呈明显的非晶态,表明粒度大小影响表面活性进而影响镀层质量。镀银后的玻璃纤维和400,2500目的SiO2微粒导电性良好,其体积电阻率分别为8.51×10-4,6.10×10-4,5.04×10-4Ω·cm。镀银玻璃纤维(由于其大的长径比)和粒度分布范围广的SiO2微粒(容易填充紧密)都具有更好的导电性,有望用于制备高导电性电磁屏蔽材料。
The electroless silver plating technology on glass fiber and SiO_2 particles with various grit sizes (400 meshes, 1 000 meshes and 2 500 meshes) were studied at-depth so as to develop high-conductive electromagnetic shielding material. The morphology of the Ag plating and the conductivity of the Ag-plated nonmetallic materials were examined as well. The results showed that the Ag plating on the glass fiber was uniform and strongly bonded to the substrate. The quality of the Ag plating on the SiO_2 particles was closely related to the particle size of the SiO_2 particulates. Namely, the electroless Ag coating deposited on the SiO_2 particles of a grit size 400 meshes was amorphous, which was related to the effect of the particle size on the surface activity and hence the quality of the Ag plating. Moreover, Ag plated glass fiber and SiO_2 particles (400 meshes, 2 500 meshes) had excellent conductivity, with the volume resistivity to be 8.51×10^-4 Ω·cm, 6.10×10^-4 Ω·cm, and 5.04×10^-4 Ω·cm, respectively. The glass fiber with a large length-diameter ratio and the Ag plated SiO_2 particles with a wide size distribution all had excellent conductivity and could be used to fabricate high-conductive electromagnetic shielding materials.[LM]
出处
《材料保护》
CAS
CSCD
北大核心
2005年第8期29-30,34,共3页
Materials Protection
关键词
化学镀银
玻璃纤维
SiO2微粒
电磁屏蔽材料
体积电阻率
electroless silver plating
glass fiber
SiO_2 particle
electromagnetic shielding material
volume resistivity
