摘要
采用无钯活化的化学镀的方法成功地制备出外镀银/铜/环氧树脂新型导电复合粒子,并对导电复合粒子进行了光学显微镜、SEM和EDS分析。结果表明:制备的导电微粒密度小,具有良好的导电性能,可以满足各向异性导电胶应用需求。
This paper presented that a novel conductive particle was prepared by no-palladium electroless plating on epoxy resin powder for anisotropic conductive adhesive. The appearances and cladding material of the conductive composite particle were observed by optical microscope, scanning electronic microscope and energy dispersive spectrometer. The results showed that conductive composite particle has a low density and good conductive performance, which can meet the demand of conductive adhesives.
出处
《化工新型材料》
CAS
CSCD
北大核心
2006年第11期60-63,共4页
New Chemical Materials
基金
上海市科委基金资助项目(03AK30)
关键词
各向异性导电胶
导电复合粒子
化学镀铜
化学镀银
anisotropic conductive adhesive, conductive composite particle, electroless copper plating, electroless silver plating
