摘要
本文以40μm的实心玻璃微殊为原料，直接采用[Ag（NH3）2]OH溶液进行活化处理，在其表面镀覆了一层致密、均匀的银层．探讨了温度、pH、银含量以及镀液添加顺序等因素时化学镀银的影响，其压实电阻、表面形貌的测试结果表明，本实验制备的镀银玻璃微珠具有较好的导电性和表面形貌，在导电填料中可替代部分银粉；当银含量为9％～15％时，D50为40μm的镀银玻璃微珠镀层最为致密、均匀.
A dense, uniform silver deposit was successfully prepared on a solid glass microbead with the diameter of 40 μm by direct activating treatment using [Ag（ NH3 ） 2 ] OH solution. The Influences of temperature, pH value, content of silver and the addition order of silver plating bath, etc , on electroless silver plating were discussed. The compact resistance and surface morphology of the electroless silver deposits were tested, and the results indicate that the silver coated glass microbead has good conductivity and surface morphology, and can replace part of silver powder as conductive filler. The silver plated glass microbead with a diameter of 40 μm has the densest and the most uniform structure as the silver content is 9% - 15%.
出处
《电镀与涂饰》
CAS
CSCD
2006年第11期17-19,共3页
Electroplating & Finishing
关键词
玻璃微珠
化学镀银
导电无机非金属材料
glass microbead
electroless silver plating
conductive inorganic non-metal materials.
