摘要
从理论上分析了Z轴微机械陀螺仪结构的工作机理,比较了体硅薄片融解工艺和DDSOG工艺的优缺点.介绍了采用DDSOG工艺加工的Z轴微机械振动陀螺的特点,并与采用体硅薄片融解工艺加工的相同Z轴微机械振动陀螺进行了残余应力、品质因数及灵敏度等性能参数的比较,采用DDSOG工艺后陀螺的驱动品质因数是原来体硅薄片融解工艺的1.45倍,而检测品质因数是原来的0.11倍.最后,比较了采用2种不同工艺加工后Z轴微机械陀螺的实验结果,结果表明采用DDSOG工艺加工后陀螺的灵敏度比原来采用体硅薄片融解工艺加工的陀螺的灵敏度提高了近10倍.
A Z-axis micromachined gyroscope is proposed. Its operating principle is analyzed in theory. The advantage and disadvantage between bulk silicon dissolved wafer process and DDSOG （ deeply dissolved silicon on glass） process are compared. The characteristic of Z-axis micromachined gyroscope from DDSOG process is introduced. The Z-axis micromachined gyroscopes from DDSOG process and bulk silicon dissolved wafer process are compared in residual stress, quality factor and sensitivity. By calculation, the drive quality factor of the gyroscope from DDOSG process is 1.45 times of that from bulk silicon dissolved wafer process, but the sense quality factor of the former is only 0. 11 times of the latter. Finally the experiment results of both kinds of gyroscope are compared and it is indicated that the sensitivity of the gyroscope from DDSOG process is about ten times greater than that from bulk silicon dissolved wafer process.
出处
《东南大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2005年第4期545-548,共4页
Journal of Southeast University：Natural Science Edition
