Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of time.Harsh environments cover areas that can be subject...Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of time.Harsh environments cover areas that can be subjected to high temperature,(bio)-chemical and mechanical disturbances,electromagnetic noise,radiation,or high vacuum.In the field of actuators,the devices must maintain stringent accuracy specifications for displacement,force,and response times,among others.These new requirements present additional challenges in the compensation for or elimination of cross-sensitivities.Many state-of-the-art precision devices lose their precision and reliability when exposed to harsh environments.It is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low maintenance.The next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design,materials,device functionality,and packaging.All of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these challenges.The main areas of importance are in the fields of materials science,micro/nano-fabrication technology,device design,circuitry and systems,(first-level)packaging,and measurement strategy.This study examines the challenges presented by harsh environments and investigates the required approaches.Examples of successful devices are also given.展开更多
文摘Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of time.Harsh environments cover areas that can be subjected to high temperature,(bio)-chemical and mechanical disturbances,electromagnetic noise,radiation,or high vacuum.In the field of actuators,the devices must maintain stringent accuracy specifications for displacement,force,and response times,among others.These new requirements present additional challenges in the compensation for or elimination of cross-sensitivities.Many state-of-the-art precision devices lose their precision and reliability when exposed to harsh environments.It is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low maintenance.The next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design,materials,device functionality,and packaging.All of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these challenges.The main areas of importance are in the fields of materials science,micro/nano-fabrication technology,device design,circuitry and systems,(first-level)packaging,and measurement strategy.This study examines the challenges presented by harsh environments and investigates the required approaches.Examples of successful devices are also given.
文摘本文利用电化学腐蚀方法制备出曲率半径<100 nm的钨针尖,并在FEI Quantum 600型扫描电镜(SEM)中作为反射靶材以搭建微焦点X射线显微系统。通过SEM发射电子束轰击纳米钨针尖,以减少电子束和靶材的物理作用区域,进而减小X射线源的光斑尺寸,实现高分辨率的X射线显微成像。采用线对卡来评价系统的最佳成像分辨率,实验结果表明:系统在加速电压30 k V、电子束束流120 n A、SEM的工作距离5 mm、放大倍数为100倍、探测器采集时间为180 s的条件下,可以获得优于1μm的分辨率图像。
