摘要
简要介绍了世界电子产品无铅化趋势及其相关立法,比较了世界各国及地区的无铅专利发展情况。对比了各国公司或个人在我国申请注册的无铅焊料相关专利,对国内无铅焊料专利权利要求书的完善提出了一些建议。最后指出了我国企业在无铅焊料专利申请上的滞后并提出相关对策。
After a brief introduction of the lead-free tendency and its relative legislation of the electronin products in worldwide, The patent development on lead-free solder in different countries and regions was compared. The patents have been applied and registered in China by foreign company or some individual was contrasted and some suggestions on domestic patent claims were given. Domestic companies lags on issuing lead-free patent were pointed out and some proposals were offered.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第4期39-41,共3页
Electronic Components And Materials
关键词
无铅
焊料
专利
知识产权
电子封装
lead-free
solder
patent
intellectual property
electronic packaging
