摘要
本文对电子产品无铅化后纯锡镀层使用带来的锡须问题进行了研究,重点分析了锡须形成的机理,锡须对电子产品可靠性的危害,提出了抑制锡须的措施,对预防锡须的形成、提高电子产品的可靠性具有参考意义。
Tin whisker caused by pure tin plating from Focused on analyzing formation mechanism of tin whisker, lead-flee electronic products is studied in this paper the tin whisker hazard to electronic products reliability is discussed, some measures to suppress tin whisker is proposed . This paper is valuable to prevent tin whisker formation and improve the reliability of electronic products.
出处
《深圳信息职业技术学院学报》
2009年第4期60-63,共4页
Journal of Shenzhen Institute of Information Technology
关键词
锡须
机理
危害
抑制
tin whisker
mechanism
danger
suppression
