摘要
用悬臂梁法研究了不锈钢4Cr13基体上的Cu膜和Ag膜的平均残余应力和残余应力分布。结果表明,Cu膜和Ag膜的平均残余应力和分布残余应力随膜厚的增加而急剧减小。2种膜生长过程中界面应力很大,而生长应力很小。Cu膜在厚度较小时,残余应力值很大,超过了铜块材的断裂强度。
Mean and local residual stresses in Cu films and Ag films on 4Cr13 substrates are evaluated by cantilever beam method. The results show that the mean and local residual stresses in Cu films and Ag films decrease abruptly with the film thickness, then tend to be stable. The residual stress in the two kinds of films mainly originates from the interfacial misfit strain. Their interfacial stress is very large and the growing stress is small. The mean value of residual stress in thin Cu films is very large, even beyond the fracture strength of the bulk Cu material.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2003年第6期478-480,共3页
Rare Metal Materials and Engineering
基金
国家自然科学基金资助项目(59831040)
国家博士学科点基金资助项目
关键词
悬臂梁法
薄膜
残余应力
界面应力
生长应力
cantilever beam method
film
residual stress
interfacial stress
growing stress
