摘要
采用内氧化工艺和粉末冶金制备了不同体积分数和不同增强相的Cu基复合材料,测试了Cu基复合材料的导电性能。结果表明,内氧化工艺制备的Al2O3/Cu复合材料的电导率和密度均高于粉末冶金工艺制备的Al2O3/Cu复合材料,且复合材料的电导率和密度随Al2O3颗粒增强相含量的增加而降低;另外,Cu基复合材料的电导率随颗粒-基体的热膨胀系数差值的增大而降低。微观组织观察表明,界面结合状态与复合材料的电导率密切相关。内氧化法制备的Al2O3/Cu复合材料比粉末冶金法制备的Al2O3/Cu复合材料晶界排列更整齐致密。
The copper-matrix composites reinforced with different nano-particles of Al2O3,SiO2,SiC and MgO in varied volumetric fraction were fabricated by internal oxidation and by powder metallurgy.The effects of preparation technology、volumetric fraction of reinforcements and thermal expansion coefficient difference between copper-matrix and reinforced particles on the electrical conductivity of the copper-matrix composites prepared were investigated.The results show that the electrical conductivity and density of Al2O3/Cu composite fabricated by internal oxidation which are increased with decreasing in Al2O3volume fraction are higher than those by powder metallurgy.The electrical conductivity of Al2O3/Cu composites is reduced with the increase of thermal expansion coefficient difference between copper-matrix and reinforced particles,which is relative with the values of calculation of the thermal stress at the copper matrix/reinforcement interface.Microstructure observation shows that the fine Al2O3particles are distributed more uniformly with alignment in the Al2O3/Cu composites fabricated by internal oxidation compared with that by powder metallurgy.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2013年第11期992-995,共4页
Special Casting & Nonferrous Alloys
基金
国家自然科学基金资助项目(51075122)
国家自然科学基金重点项目(U1034002)
关键词
颗粒增强Cu基复合材料
电导率
粉末冶金
界面应力
Copper-Matrix Composites,Electrical Conductivity,Powder Metallurgy,Interface Thermal Stress
