摘要
本研究旨在探索嵌埋导热通道环氧树脂基线路板(FR4)在车灯散热中的应用潜力。通过仿真模拟,对FR4与传统的金属基贴片板在25℃稳态工况下的散热性能进行了对比和评价,发现二者在散热效果上表现接近,而前者更具成本效益与设计灵活性方面的优势。实验结果与数值模拟基本一致,验证了仿真的准确性,同时表明嵌埋导热通道的FR4可以有效降低车灯工作时的温度,解决了高功率车灯的散热难题。本文的研究成果不仅提升了车灯的散热性能,还拓宽了材料选择范围,为汽车照明技术的发展提供了经济高效的新方案,有着广阔的工程应用前景。
The paper aims to explore the potential application of embedded Flame-Retardant 4 printed circuit boards(FR4)in automotive lighting heat dissipation.Through simulation,a comparative analysis and evaluation of the thermal performance between FR4 and conventional metal core printed circuit boards under steady-state operating conditions at 25℃ were conducted.The findings reveal that both exhibit comparable heat dissipation efficacy,with the former demonstrating superior cost-effectiveness and design flexibility.The experimental results closely align with the numerical simulations,validating the accuracy of the simulations and concurrently demonstrating that FR4 can effectively reduce the operating temperatures of automotive lamps,thereby addressing the heat dissipation challenges posed by high-power lighting systems.This research not only enhances the thermal management capabilities of automotive lighting but also broadens the scope of material selection,offering an economically viable and efficient new approach for advancing automotive lighting technology.Consequently,it holds promising engineering application prospects for the automotive industry.
作者
何渊
刘智晁
丁博岩
谢延青
HE Yuan;LIU Zhichao;DING Boyan;XIE Yanqing(Saic Volkswagen Automotive Co.,Ltd.,Shanghai 201805,China;Hasco Vision Technology(Shanghai)Co.,Ltd.,Shanghai 201821,China)
出处
《中国照明电器》
2024年第11期103-106,共4页
China Light & Lighting
