摘要
研究了采用回流焊炉完成大尺寸异型印制电路板与金属基板的焊合工艺,对温度曲线、定位精度和空洞率控制进行了理论计算和针对性的设计优化,并对优化后的工艺方法进行了生产试制。试制结果表明采用常规回流焊炉也能完成高质量等级的低空洞率要求的大尺寸印制板焊合任务。
Investigated technology of reflow soldering between large-size PCB and metal board, analyzed and optimized the temperature curve, positioning accuracy, void ratio control from theory and practice, and proceeded trial production with optimized process. The result showed that the conventional reflow oven can meet the requirements of soldering between large-size PCB and metal board in high quality and low void.
出处
《电子工艺技术》
2017年第1期24-25,36,共3页
Electronics Process Technology
