摘要
采用端乙烯基硅油、球形氧化铝、铂催化剂、含氢硅油等制得加成型双组分有机硅导热灌封胶,研究了球形氧化铝复配质量比和粒径搭配、含氢硅油用量对灌封胶性能的影响。结果表明,采用平均粒径45μm和5μm球形氧化铝复配作导热填料时,随着较小粒径(5μm)球形氧化铝在导热填料中质量分数的增加,有机硅灌封胶的热导率先升后降。当5μm球形氧化铝在导热填料中质量分数为40%时,有机硅灌封胶的热导率达到最大值1.63 W/(m·K);固定较大与较小粒径球形氧化铝质量比6∶4,随着较小粒径球形氧化铝粒径的减小,有机硅灌封胶的热导率和邵氏A硬度升高。随着较大粒径球形氧化铝粒的增大,有机硅灌封胶的热导率升高;随着交联剂含氢硅油用量的增加,有机硅灌封胶的可操作时间大幅缩短并趋于稳定,邵氏A硬度升高并趋于稳定。
A two-component thermal conductive silicone encapsulant was prepared by end-vinyl silicone oil,spherical alumina,platinum catalyst and hydrogen silicone oil.The effects of the mass ratio and particle size of spherical alumina and the amount of hydrogen silicone oil on the properties of the silicone encapsulant were studied.The results show that when the spherical alumina with average particle size 45μm and 5μm is used as thermal conductive fller,silicone encapsulant increases the thermal conductivity first and then decreases with the increase of spherical alumina with smaller particle size(5μm).When the mass fraction of 5μm spherical alumina in the thermal conductive filler is 40%,the thermal conductivity of silicone encapsulant reaches the maximum of 1.63 W/(m·K).The mass ratio of large and small spherical alumina is 6:4,the thermal conductivity and Shore A hardness of silicone encapsulant increases with the decrease of small size spherical alumina,and the thermal conductivity of silicone encapsulant increases with the increase of large size spherical alumina.With the increase of hydrogen silicone oil,the silicone encapsulant shortens its operable time and tends to be stable,and Shore A hardness is increased and becomes stable.
作者
吴生煜
WU Shengyu(Xiamen Talentmats New Materials Science&Technology Co.,Ltd.,Xiamen 361015,China)
出处
《有机硅材料》
CAS
2024年第3期30-34,共5页
Silicone Material
关键词
有机硅灌封胶
热导率
硬度
可操作时间
silicone encapsulant
thermal conductivity
hardness
operation time
