摘要
4047硅铝合金被广泛用作微波电子封装材料,为了支撑该材料在电子封装领域的应用,文中选择了4047硅铝合金盖板与6063铝合金腔体组成的激光焊样件进行研究。通过对焊接件的微观组织、气密性和力学性能等进行分析,发现焊接区存在气孔、裂纹、夹渣等缺陷,但没有贯穿焊缝的气孔和裂纹;拉伸试样断裂均在焊缝处,焊缝的强度可以达到4047硅铝合金母材强度的75%以上。为了减少焊接缺陷的产生,焊前应将焊缝处铝合金表面的氧化膜、杂质等去除干净,同时焊缝组织中缺陷的减少可以提高焊缝强度。
4047 silicon aluminum alloy was widely used as microwave electronic packaging materials.In order to support the application of this material in the field of electronic packaging,this paper selected the laser welding sample composed of 4047 silicon aluminum alloy as cover plate and 6063 aluminum alloy as box for research.Through the analysis of microstructure,air tightness and mechanical properties of welding parts,it was found that there were some defects such as pores,cracks and slag inclusions in the welding area,but there were no pores and cracks penetrating the weld.The tensile samples all broked at the weld,and the strength of weld could reach more than 75%of the strength of 4047 silicon aluminum alloy base metal.In order to reduce the occurrence of defects during welding,the oxide film and impurities on the aluminum alloy surface at the weld should be cleaned before welding.At the same time,the reduction of defects in the weld tissue could improve the strength of weld.
作者
曹洪志
李琳
闫丽珍
王天石
陈帅
唐斯琪
CAO Hongzhi;LI Lin;YAN Lizhen;WANG Tianshi;CHEN Shuai;TANG Siqi(The 29th Research Institute of CETC,Chengdu 610036,Sichuan pro.,China;GRIMAT Engineering Institute Co.,Ltd.,Beijing 101407,China)
出处
《焊接技术》
2023年第11期14-18,I0001,共6页
Welding Technology
关键词
4047硅铝合金
激光焊
气密性
微观组织
力学性能
4047 silicon aluminum alloy
laser welding
air tightness
microstructure
mechanical property
