摘要
根据高熵合金设计原理设计了多组元Sn基高温无铅软钎料,研究了Sn-Cu-Co-Ni-Bi系钎料合金的微观组织、力学性能和钎焊性能随合金混合熵改变的变化规律。结果表明,钎料合金的微观组织由固溶体和析出相Sn、Bi、CoSn_(2)、Cu_(6)Sn_(5)和Ni3Sn_(4)组成,随着混合熵值的增大,钎料合金组织中的固溶体含量逐渐增大,Sn基体含量逐渐降低,且硬度逐渐增大,维氏硬度(HV0.5)最高为410,布氏硬度(HB)最高为158。抗拉强度先增大后减小,且在中熵成分时最大,耐腐蚀性能呈增强趋势。钎料合金熔点为138~269℃,电阻率为0.182~1.25μΩ·m。随着混合熵值的增大,电阻率虽呈增大趋势,但仍与Sn-90Pb钎料电阻率接近。
Multi-component Sn-based high-temperature lead-free solder was designed according to the principle of high-entropy alloy.The variation law of microstructure,mechanical properties and soldering performance of Sn-Cu-Co-Ni-Bi series solder alloys with the mixing entropy of alloy were investigated.The results indicate that the microstructure is composed of solid solution and precipitation phases of Sn,Bi,CoSn_(2),Cu_(6)Sn_(5) and Ni_3Sn_(4).With the increase of mixing entropy value,the content of solid solution in the solder alloy is gradually increased,the content of Sn matrix is gradually decreased,and the hardness value is gradually increased,where Vickers hardness reaches up to 410 HV_(0.5),and Brinell hardness reaches up to 158 HB.The tensile strength of the solder is firstly increased and then decreased,which reaches the maximum at the medium entropy composition,and the corrosion resistance presents a trend of gradual enhancement.The melting points of solder alloys are 138℃to 269℃,and the resistivity is in ranges of 0.182μΩ·m to 1.25μΩ·m.With the increase of mixing entropy,the resistivity is increased gradually,which is still close to that of Sn-90Pb solder.
作者
樊江磊
王娇娇
王宁格
吴深
周向葵
李莹
王艳
Fan Jianglei;Wang Jiaojiao;Wang Ningge;Wu Shen;Zhou Xiangkui;Li Ying;Wang Yan(School of Mechanical and Electrical Engineering,Zhengzhou University of Light Industry)
出处
《特种铸造及有色合金》
CAS
北大核心
2023年第12期1591-1597,共7页
Special Casting & Nonferrous Alloys
基金
河南省自然科学基金资助项目(222300420584)。
关键词
无铅钎料
高熵合金
微观组织
力学性能
钎焊性能
Lead-free Solder
High Entropy Alloy
Microstructure
Mechanical Properties
Solderability
