摘要
对应用在真空电子管中的Ag Cu Ni焊料进行X射线荧光分析、封接性能测试以及显微结构观察,从理化分析的角度来说明该使用焊料的可行性。
Ag-Cu-Ni brazing material was analyzed by physical-chemical methods, such as XRFS, sealing performance inspection and microstructure examination. It is indicated that Ag-Cu-Ni brazing material to be applied for vacuum interrupter is feasible.
出处
《真空电子技术》
2004年第4期45-48,共4页
Vacuum Electronics
关键词
Ag-Cu-Ni焊料
封接性能
显微结构
理化分析
可行性
Ag-Cu-Ni brazing material
Sealing performance
Microstructure
Physical-chemical analysis
Feasibility
