摘要
针对片式聚合物钽电容器在湿热环境中性能退化的问题,通过湿热贮存实验研究其电参数变化及结构变化,阐释其湿热敏感性。利用有限元法(Finite Element Method,FEM)模拟钽电容器在湿热环境下的应力分布,阐述其湿热敏感性机理。实验结果表明,在85℃/85%RH的湿热环境下,电容器电容量参数严重恶化,环氧塑封料中出现大量气孔,并在回流焊后电容器表面出现裂纹。仿真结果表明,在湿热和蒸汽压综合影响下,电容器钽棒出口处应力达45.73 MPa,是导致电容器失效的原因。而经120℃热处理24 h,电容器的电容量参数得到明显改善且回流焊后电容器的微观结构破坏程度较小,其可靠性提高。
To address the performance degradation of polymer tantalum chip capacitors in the hygrothermal environment,the hygrothermal storage tests were conducted to study the changes in their electrical parameters and structure,elucidating their moisture-heat sensitivity.The stress distribution of tantalum capacitors was simulated under a hygrothermal environment by FEM,and the mechanism of their moisture-heat sensitivity was expounded.The experimental results show that the capacitance parameters of the capacitor seriously deteriorate in the hygrothermal environment at 85℃/85%RH.Large amount of pores appear in the epoxy molding compound,and cracks appear on the surface after reflow.Simulation results show that under the comprehensive effects of thermal humidity and vapor pressure,the stress reaches 45.73 MPa at the outlet of the tantalum rod of the capacitor,which is the cause of the capacitor failure.After heat treatment at 120℃for 24 h,the capacitance parameters were significantly improved,and the microstructure of the capacitor was less damaged after reflow with enhanced reliability.
作者
原小慧
刘林杰
成吉
王晨曦
YUAN Xiaohui;LIU Linjie;CHENG Ji;WANG Chenxi(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin150001,China)
出处
《电子元件与材料》
CAS
北大核心
2023年第8期961-968,共8页
Electronic Components And Materials
基金
国家自然科学基金面上项目(51975151)
黑龙江省自然科学基金联合引导项目(LH_(2)019E041)。
关键词
钽电容
湿热敏感性
有限元法
可靠性
热处理
tantalum capacitors
moisture-heat sensitivity
FEM
reliability
heat treatment
