摘要
对微波T/R组件硅铝腔体出现的连续带状条纹现象,采用拉伸强度测试、金相、扫描电子显微镜及能谱对材料力学性能、微观组织等进行了分析试验。结果表明,条纹区域微观组织是由初晶硅相、α-Al相及部分杂质相聚集形成的细晶区,硅相平均尺寸较正常区域小。进一步分析了条纹产生的原因是,喷射沉积过程中因沉积盘导热率低使部分组织重新熔化,杂质相随液相扩散,形核质点增多,硅相在冷却过程中受其影响被细化形成带状的细晶区。根据原因制定了控制措施,通过改进沉积盘材质及结构以提高喷射沉积过程的散热效率,经验证措施有效。
In this paper,the continuous banded phenomenon in the silicon aluminum cavity of microwave T/R module is analyzed and tested by tensile strength test,metallography,scanning electron microscope and energy spectrum.The results show the microstructure of the fringe region is a fine crystal region formed by the aggregation of primary silicon phase,α-Al phase and some impurity phases.The average size of the silicon phase is smaller than that of the normal region.It is further analyzed that the reason for the formation of streaks is that the low thermal conductivity of the deposition disk in the process of jet diposition makes part of the microstructure remelt,the impurity phase diffuses with the liquid phase,the nucleation particle increases,and the silicon phase is refined to form a zonal fine crystal during the cooling process.According to the reasons,the control measures are developed,and the heat dissipation efficiency is improved by improving the material and structure of the deposition.
作者
田阳
杨洋
罗伟
吕滨草
唐勇刚
Tian Yang;Yang Yang;Luo Wei;Lv Bincao;Tang Yonggang(Chengdu SIWI High-Tech Industry Co.,LTD,Chengdu 611730,China)
出处
《有色金属加工》
CAS
2023年第1期44-47,52,共5页
Nonferrous Metals Processing
关键词
硅铝合金
电子封装
条纹
喷射沉积
Si-Al alloys
electronic packaging
crack
spray deposition
