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基于多轴对准定位平台提升LDI机生产效率的探讨

Discussion on improving the production efficiency of LDI machine based on multi-axis alignment positioning stage
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摘要 为了满足印制电路板分区域基板对位应用需求,提升LDI机生产效率,文章设计了一种应用于LDI机的多轴对准定位平台。多轴对准定位平台包含多组对准定位平台,通过平台控制系统移动对准定位平台到基板对位点,对准测量系统采集多对位点图像信息,使用LDI技术实现图形转移完成基板曝光。从对准时间测试数据分析看,随着基板分区域越多,以及对准定位平台轴数的增多,多轴对准定位平台提升LDI机生产效率越显著。 In order to meet the application requirements of sub-region exposure substrate alignment of Printed Circuit Board, and to improve the production efficiency of LDI exposure machine, one kind of multi-axis alignment positioning stage is designed and applied to LDI exposure machine. The multi-axis alignment positioning stage contains multiple alignment positioning stage. The stage control system moves alignment positioning stage to alignment points of substrate,then alignment measuring system collects the image information of alignment points, thus LDI technology is used to realize the graphic transfer and complete the substrate exposure. From analysis of the alignment time test data, and with more subregions of substrate and axis number of the alignment positioning stage, more significant production efficiency of LDI exposure machine is improved by multi-axis alignment positioning stage.
作者 李辉 方林 刘国藩 杨坤伦 侯荣伟 Li Hui;Fang Lin;Liu Guofan;Yang Kunlun;Hou Rongwei(Circuit Fabology Microelectronics Equipment CO.,LTD.,Anhui Hefei,230000)
出处 《印制电路信息》 2022年第12期1-6,共6页 Printed Circuit Information
关键词 激光直接成像 对准测量系统 对准定位平台 运动控制 LDI Alignment Measuring System Alignment Positioning Stage Motion Control
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  • 1陈彦青,汪方宝,管美章.微波PCB特种制造技术[J].电子工艺技术,2007,28(1):34-37. 被引量:4
  • 2[1]Arvind Partha,Zemel M.A Comparison of PCB Imaging Technologies[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001. Anaheim CA USA.S15-2-1. 被引量:1
  • 3[2]Itzhak Taff.Direct Image - Major Trends and Impact on PCB Manufacturers[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001.Anaheim CA USA.S04-1-1. 被引量:1
  • 4[3]David E Stone.Laser Direct Imaging-A cost Effective Choice[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001.Anaheim CA USA.S18-3-1. 被引量:1
  • 5[4]Shavi Spinzi.Direct Imaging Implementation: Real World Case Studies[C].TPCA2000 Forum Proceedings,2000.Taipei.90-95. 被引量:1
  • 6[5]Gunther Enne.Laser Direct Imaging for Precise Positioning of Circuitry With HDI/Micro Vias and SBU Technologies[C].TPCA2000 Forum Proceedings,2000.377-384. 被引量:1
  • 7[6]Christophe Vaucher.New Technologies in Advanced PCB Manufacture[J].Printed Circuit Europe, 2001,23(1):20-22. 被引量:1
  • 8Sri Venkat.Laser Developments Expand LDI Capabilities[J].Circuitree,2005(9):49-51. 被引量:1
  • 9毛小红,高能武,项博,秦跃利.微波单片陶瓷电路技术研究[J].电子工艺技术,2009,30(2):86-88. 被引量:8
  • 10高能武,曾策,秦跃利.微波印制电路板制造工艺及其电阻集成[J].电子元件与材料,2009,28(11):68-70. 被引量:4

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