摘要
概述了目前印制电路板制造中激光在成像和钻孔的主要应用;重点介绍了利用激光直接成像技术进行的精细线路制作,在激光钻孔工艺中采用激光诱发进行直接电镀以及在AlN陶瓷基板上进行激光辅助活化制作线路和孔;并提出了今后的发展方向。
The main applications of laser at present are imaging and drilling in PCB manufacturing. The use of laser direct imaging technique in fine lines fabrication, the laser-induced direct plating in the laser drilling process and the laser-assisted activation in the line and hole production on AIN ceramic substrates are introduced in detail and the development directions of Laser Application are proposed.
出处
《印制电路信息》
2012年第4期13-15,共3页
Printed Circuit Information
关键词
激光
成像
钻孔
活化
Laser
Imaging
Drilling
Activation
