摘要
满足PCB制作技术的高速发展和HDI micro-via-hole形成等关键技术的需要,激光成孔技术在国内得到广泛应用和发展。本文针对我国HDI(高密互连PCB)生产现状,就目前普遍使用的CO2激光成孔技术进行了初步研究、阐述了CO2激光脉冲能量、光点尺寸、脉冲宽度和次数对成孔孔径、孔深及其质量的影响,并就其结果进行了分析、对比和研究。
To satisfy demand of high speed development in manufacturing technology on PCB and key technology such as forming of micro-via-hole on HDI, it has obtained abroad national application and progress for forming-hole technology by laser shooting. According to productive actuality of HDI in our country, the new forming-hole technology at large used now is primary studied, and the relations which they influence hole-diameter, depth and its quality with pulse-energy, light-dot-size, pulse-width and times for CO2 laser are set forth, then the results are analyzed, contrasted and studied in this paper.
出处
《应用激光》
CSCD
北大核心
2007年第2期144-147,共4页
Applied Laser
