摘要
为满足航天电子产品的高可靠性要求,依据航天行业标准开展了表面贴装器件的可靠性工艺研究。重点研究了回流焊工艺参数对LGA(Land Grid Array,平面栅格阵列封装)器件的焊点空洞率和IMC(Intermetallic Compound,金属间化合物)层厚度的影响,通过可靠性验证检测,得出了适合产品特点和工艺要求的LGA器件的焊接工艺。
In order to meet the high reliability requirements of aerospace electronic products,the unit carries out the reliability process research of surface mount devices in accordance with aerospace industry standards,focusing on the influence of reflow process parameters on the void ratio of solder joint and the thickness of IMC layer of LGA packaging devices,and passed the reliability verification test.The soldering process of LGA packaging device which is suitable for the product characteristics and process requirements of the unit is obtained.
作者
杨伟
邴继兵
高燕青
黎全英
毛久兵
YANG Wei;BING Jibing;GAO Yanqing;LI Quanying;MAO Jiubing(The 30th Research Institute of CETC,Chengdu 610041,China)
出处
《电子工艺技术》
2022年第6期334-337,共4页
Electronics Process Technology
关键词
航天电子产品
可靠性
LGA
工艺研究
aerospace electronic products
reliability
LGA
process research
