摘要
随着深空探测卫星、可重复发射火箭等航天产品的应用发展,传统高可靠核心电子器件陶瓷球栅阵列(CBGA)、锡柱陶瓷柱栅阵列(CCGA)封装形式面临大温变、高冲击、长时振动等环境带来的极为严峻的组装可靠性挑战。新型微簧结构柱栅阵列封装因其特殊封装形式带来的优势成为上述恶劣环境下可靠应用的新选择。对微簧结构柱栅阵列发展、组装工艺及可靠性研究现状进行了总结分析,主要包括国内外微簧结构柱栅阵列封装的器件级微簧植装和板级组装两方面。进一步结合传统成熟锡柱CCGA的研究情况,综合考虑国内外微簧结构柱栅阵列研究现状及国内航天产品服役场景,给出了微簧结构柱栅阵列封装实现可靠应用的研究思路。
With the application and development of aerospace products,such as deep space exploration satellites and re-launchable rockets,the conventional ceramic ball grid array(CBGA)and solder column ceramic column grid array(CCGA)packaging forms for high-reliability key electronic components face extremely severe assembly reliability challenges due to large temperature change,high-strength shock,long-term vibration and other environments.The new micro-spring structure column grid array package has become a new choice for reliable applications in the above-mentioned harsh environments due to the advantages brought by its special packaging form.The development and the research status of micro-spring structure column grid array assembly process and reliability are summarized and analyzed,mainly including the component-level micro-spring implantation and board-level assembly of the micro-spring structure column grid array packaging at home and abroad.Furthermore,combined with the research situation of conventional mature solder column CCGA,comprehensively considering the research status of micro-spring structure column grid array at home and abroad and the service scene of domestic aerospace products,the research idea for the reliable application of micro-spring structure column grid array package is given.
作者
周强
李青
洪元
高鹏
周旭
周玥
耿煜
Zhou Qiang;Li Qing;Hong Yuan;Gao Peng;Zhou Xu;Zhou Yue;Geng Yu(Space Star Technology Co.,Ltd.,Bejing 100095,China)
出处
《半导体技术》
CAS
北大核心
2022年第10期774-780,共7页
Semiconductor Technology
基金
国家自然科学基金青年科学基金资助项目(51801079)。
关键词
大温变
高冲击
长时振动
微簧结构柱栅阵列
组装工艺
large temperature change
high-strength shock
long-term vibration
micro-spring structure column grid array
assembly process
