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一种X波段十六通道瓦片式T/R组件的研制

Development of an X-Band 16-Channel Tile-Type T/R Module
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摘要 基于三维垂直互连技术研制了一种X波段十六通道器件级瓦片式T/R组件。该组件采用了幅相多功能芯片、收发前端、功分器、双向放大器等可以直接贴装的器件,具有6位移相、6位衰减、功率放大、低噪声放大以及收发切换等功能。结构形式为4×4的瓦片,提出了使用球栅阵列(Ball Grid Array,BGA)实现组件与天线的垂直互连。应用表面贴装技术(Surface Mount Technology,SMT)对T/R组件进行了装配,使用微波探针对T/R组件进行了测试。测试结果显示,在X波段内,单路发射通道的饱和输出功率大于30 dBm,接收通道增益大于20 dB,噪声系数小于3.5,移相精度≤4°,衰减精度≤1 dB,组件尺寸为64 mm×64 mm×20 mm。 An X-band 16-channel device level tile-type T/R module was developed based on 3d vertical interconnection technology.The module adopts amplitude-phase multifunctional chip,transceiver front-end,power divider,bidirectional amplifier and other devices that can be directly mounted,with 6 displacement phase,6 bit attenuation,power amplification,low noise amplification,transceiver switch and other functions.The structure is 4×4 tiles,and a Ball Grid Array(BGA)is proposed to realize the vertical interconnection between components and antennas.Surface Mount Technology(SMT)was used to assemble the T/R module,and the microwave probe was used to test the T/R module.The test results show that in the X-band,the saturation output power of the single transmitting channel is greater than 30 dBm,the gain of the receiving channel is greater than 20 dB,the noise coefficient is less than 3.5,the phase shift accuracy is less than 4°,the attenuation accuracy is less than 1 dB,and the component size is 64 mm×64 mm×20 mm.
作者 王立发 WANG Lifa(China Electronic Science and Technology Corporation,13th Research Institute,Shijiazhuang 050051,China)
出处 《通信电源技术》 2022年第9期10-12,共3页 Telecom Power Technology
关键词 T/R组件 瓦片式 器件级 X波段 垂直互连 T/R module tile type device level X-band vertical interconnection
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