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一种基于毛纽扣的垂直互联结构 被引量:3

A vertical interconnection structure based on Fuzz Button
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摘要 随着相控阵雷达系统小型化的发展,瓦片式收发组件逐渐取代砖块式收发组件成为研究和应用的热点。而垂直互联技术是实现瓦片式收发组件在垂直方向上进行基板堆叠、实现各个平面间的射频和数字信号连通的关键所在。本文基于瓦片式收发组件在垂直互联上的需求,运用同轴结构传输模型,构建了一种基于毛纽扣连接器的垂直互联结构。该结构用于垂直方向上的板间互联,并使用低温共烧陶瓷基板进行了性能测试,在10 GHz附近拥有1.1的驻波和0.4 dB的插入损耗,且具有应用灵活,装配简便的特点。 With the development of miniaturization of phased array radar system,tile-type transceiver module has gradually replaced brick-type transceiver module as a research and application hotspot.Vertical interconnection technology is the key to realize tile-type transceiver module stacking in vertical direction and RF or digital signal communication between different planes.In this paper,a vertical interconnection structure based on Fuzz Button connector is constructed by using coaxial structure transmission model to meet the vertical interconnection requirement of tile-type transceiver module.The structure is used for interconnection between substrates in vertical direction and the performance of the structure is tested on low temperature co-fired ceramic substrates.It has standing wave of 1.1 and insertion loss of 0.4 dB near 10 GHz.It is flexible in application and easy to assemble.
作者 滕鲁 喻忠军 TENG Lu;YU Zhong jun(Institute of Electronics,Chinese Academy of Sciences,Beijing 100089,China)
出处 《电子设计工程》 2019年第21期156-159,共4页 Electronic Design Engineering
关键词 垂直互联 毛纽扣 同轴结构 低温共烧陶瓷(LTCC) vertical interconnection Fuzz Button coaxial structure Low Temperature Co-fired Ceramics(LTCC)
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  • 1高勇,王绍东.采用LTCC技术的X波段接收前端MCM设计[J].现代雷达,2008,30(5):106-108. 被引量:13
  • 2王周海,李雁,王小陆,郑林华.X波段双通道T/R组件的LTCC基板电路的设计[J].雷达科学与技术,2005,3(5):301-305. 被引量:21
  • 3严伟,禹胜林,房迅雷.基于LTCC技术的三维集成微波组件[J].电子学报,2005,33(11):2009-2012. 被引量:37
  • 4Gregorwich W. Conformal Airborne Arrays[ C]// Proceedings of IEEE Aerospace Conference. Snawmass at Aspen, Co: IEEE, 1997: 463 - 470. 被引量:1
  • 5Haube M S, Wooldridge J J. High density packaging of X - band active array modules[J]. IEEE MTT_ S Digest, 1997,20(3) : 279 - 291. 被引量:1
  • 6Watson T, Miller S, Kershner D, et al. Design of a K - band Transmit Phased array for low earth orbit satellite communica- tiom[ C ]//Proceedings of 2000 IEEE International Confer- ence on Phased Array Systems and Technology. Dana Point, California: IEEE, 2000: 211 - 214. 被引量:1
  • 7Stefano Vaccaro, Daniel Llorens delRio, Roberto Tortes SOnehez, et al. Low cost phaseed army for mobile Ku- band satellite terminal[ C ]//Proceedings of the Fourth European Conference on Antennas and Propagation. Barcelona, Spain: IEEE, 2010:1 - 5. 被引量:1
  • 8Rens Baggen, Stefano Vaccsro, Daniel Llorensdel Rio, et al. First Prototyping of a Compact Mobile Ku - Band Satellite Terminal[ C]//Proceedings of the Fourth European Confer- ence on Antennas and Propagation. Barcelona, Spain: IEEE, 2010:1 - 4. 被引量:1
  • 9Schreiner M, Leier H, Menzel W, et al. Architecture and in- terconnect technologies for a novel conformal active phased array radar module[ C]//Proceedings of 2003 IEEE MTY- S International Microwave Symposium Digest. Philadelphia: IEEE, 2003 : 567 - 570. 被引量:1
  • 10Hauhe M S,Wooldridge J J. High density packaging of Xbandactive array modules [J]. IEEE Transactions onComponents,Packaging, and Manufacturing Technology,1997,20(3):279-291. 被引量:1

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