摘要
随着微电子领域的迅速发展,我国柔性线路板市场迎来新的增长空间,因此,在微电子器件工业中,对具有高玻璃化转变温度及合理的热膨胀系数的塑料基板的需求逐渐增多。材料的玻璃化转变温度、热膨胀系数限制了柔性基板在加工过程中温度的选择及其应用范围。聚酰亚胺(PI)作为聚合物材料中综合性能最佳的材料之一,由于其具有玻璃化转变温度(T_(g))和热膨胀系数(CTE)的高度可发展性,使聚酰亚胺在柔性基板的开发应用过程中受到重视。聚酰亚胺作为柔性基板材料,起到载体的作用,是柔性线路板的重要组成部分。文章主要叙述了聚酰亚胺单体的选择对柔性基板加工温度的影响,及无机粒子的掺杂对聚酰亚胺复合薄膜热性能的影响。
With the rapid development of the microelectronics field,my country’s flexible circuit board market has new room for growth,therefore,the demand for plastic substrates with high glass transition temperature and reasonable thermal expansion coefficient in the microelectronic device industry is gradually increasing.The glass transition temperature and thermal expansion coefficient of the material can limit the temperature selection and application range of the flexible substrate during processing.Polyimide(PI)is one of the materials with the best comprehensive performance in polymer materials.Because of highly developable of glass transition temperature(T_(g))and coefficient of thermal expansion(CTE),make polyimide valued in the development and application of flexible substrates.As a flexible substrate material,polyimide acts as a carrier and is an important part of flexible circuit boards.The article mainly describes the influence of the choice of polyimide monomer on the processing temperature of the flexible substrate;and the influence of the doping of inorganic particles on the thermal properties of the polyimide composite film.
作者
韩常雨
刘姣
张小舟
马德彪
王锦艳
HAN Changyu;LIU Jiao;ZHANG Xiaozhou;MA Debiao;WANG Jinyan(College of Materials Science and Engineering,Qiqihar University,Qiqihar,Heilongjiang 161006,China;Heilongjiang Province Key Laboratory of Polymeric Composition Material,Qiqihar,Heilongjiang 161006,China;Department of Polymer Science&Engineering,Dalian University of Technology,Dalian,Liaoning 116024,China)
出处
《塑料》
CAS
CSCD
北大核心
2022年第1期111-116,共6页
Plastics
基金
黑龙江省省属高等学校基本科研业务费科研项目(300658)
黑龙江省省属高等学校基本科研业务费科研项目(135309510)
齐齐哈尔大学研究生创新科研项目(YJSCX2020017)。
关键词
柔性线路板
柔性基板
聚酰亚胺
玻璃化转变温度
热膨胀系数
flexible circuit board
flexible substrate
polyimide
glass transition temperature
thermal expansion coefficient
