摘要
多层陶瓷电容器(MLCC)在电子、通信、航天等领域应用广泛,MLCC铜端电极对MLCC的性能起到关键性作用。探究了玻璃粉体系对MLCC铜端电极组织、性能的影响,分析了不同尺寸的玻璃体系对铜端电极的组织结构及耐酸性能的影响,研究表明:ZnO-B_(2)O_(3)-SiO_(2)体系制备的端电极烧结后在端电极与瓷体之间界面处形成较厚的过渡层,这有利于提高端电极在瓷体上的附着力,但端电极表面出现玻璃泡结构,不利于后续的电镀工艺。降低ZnO-B_(2)O_(3)-SiO_(2)体系玻璃粉尺寸,烧结后界面处形成更厚的过渡层,但端电极表面出现了更多的玻璃泡。向D50为1.5μm的ZnO-B_(2)O_(3)-SiO_(2)玻璃粉制备的浆料内加入一定量的BaO-ZnO-B_(2)O_(3)体系玻璃粉,烧结表面的玻璃泡结构经镀液腐蚀后消失,有利于镀层均匀附着在端电极上,从而更适合MLCC用铜端电极浆料的开发。
Multilayer Ceramic Capacitors(MLCC)are widely used in the fields of electronics,communications,aerospace,etc.And copper terminal electrode plays a key role in the performance of MLCC.This paper explored the influence of glass powder systems on the structure and performance of copper terminal electrode.The effects of glass systems with different sizes on the microstructure and acid resistance of the copper terminal electrode were analyzed in detail.The conclusions are as followed.A thick transition layer was formed at the interface between the terminal electrode prepared by ZnO-B_(2)O_(3)-SiO_(2)glass powder system and the ceramic body after sintering,improved the adhesion of the terminal electrode on the ceramic body.While the glass bubbles formed on the surface of the terminal electrode were harmful for the subsequent electroplating process.And a thicker transition layer was formed at the interface after sintering with more glass bubbles appeared on the surface of the terminal electrode by reducing the size of the ZnO-B_(2)O_(3)-SiO_(2)glass powder.Then the ZnO-B_(2)O_(3)-SiO_(2)glass powder slurry with a 1.5μm size(D50)mo⁃dified by adding a certain amount of BaO⁃ZnO⁃B_(2)O_(3)glass powder system resulted the glass bubbles on the sintered surface disappeared after etching by plating solutions,which is beneficial to achieve a uniform coating on the terminal electrode for electroplating,and more suitable for the copper paste of terminal electrode.
作者
靳学昌
高珺
李岩
陈将俊
刘春静
赵宁
JIN Xuechang;GAO Jun;LI Yan;CHEN Jiangjun;LIU Chunjing;ZHAO Ning(School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China;Dalian Overseas Huasheng Electronic Technology Co.,Ltd.,Dalian 116023,China)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2021年第S02期294-297,317,共5页
Materials Reports
基金
国家自然科学基金(52075072)
中央高校基本科研业务费专项资金(DUT20JC46)。
关键词
多层陶瓷电容器
端电极
电极浆料
玻璃粉
multilayer ceramic capacitor
terminal electrode
electrode paste
glass powder
