摘要
倒装芯片球栅阵列(FCBGA)基板具有尺寸大、层数多等特点,可以满足大尺寸芯片超高速运算的需求。随着芯片尺寸的增大,有机基板的翘曲问题变得更加突出,因此,需要对有机基板材料在热膨胀系数(CTE)、模量、树脂收缩率、应力控制等方面进行升级。对FCBGA基板使用的大尺寸有机基板材料进行研究,重点研究其关键性能参数,如CTE、模量和树脂收缩率等,进一步探讨了对树脂基体、无机填料和玻璃纤维布等材料的选择以及生产制造过程中的应力控制,并对大尺寸有机基板材料技术的发展趋势进行了展望。
Due to the characteristics such as large size and large number of layers,flip chip ball grid array(FCBGA)substrates can meet the needs of large-size chips for ultra-high-speed computing.As the chip size increases,the warpage problem of organic substrates becomes more prominent.Therefore,technological upgrading of organic substrate materials in terms of coefficient of thermal expansion(CTE),modulus,resin shrinkage rate,and stress control is required.The large-size organic substrate materials used in FCBGA substrates are studied focusing on the key performance parameters,such as CTE,modulus,and resin shrinkage rate,the selection of materials such as resin matrix,inorganic filler,and glass fiber cloth,as well as stress control in the production and manufacturing process are further explored,and the development trend of large-size organic substrate material technology is outlooked.
作者
李志光
胡曾铭
张江陵
范国威
唐军旗
刘潜发
王珂
LI Zhiguang;HU Zengming;ZHANG Jiangling;FAN Guowei;TANG Junqi;LIU Qianfa;WANG Ke(Guangdong Shengyi Technology Co.,Ltd.,Dongguan 523808,China;School of System Design and Intelligent Manufacturing,Southern University of Science and Technology,Shenzhen 518055,China)
出处
《电子与封装》
2024年第2期41-48,共8页
Electronics & Packaging
关键词
大尺寸有机基板材料
翘曲
应力控制
large-size organic substrate material
warpage
stress control
