摘要
为满足红外探测系统无热化、高质量成像的需求,在非球面硫系玻璃基底制备3.7~4.8μm波段增透膜。根据试验要求选取黏结层材料,提高基板与薄膜之间的附着力;利用有限元分析法通过多物理场仿真软件,将温度场与热应力场相结合建立三维模型,分析非球面薄膜的应力分布情况。根据模拟结果对沉积工艺进行优化,采用温度梯度烘烤法降低硫系玻璃基底的热应力,并采用真空原位退火法释放沉积薄膜的应力,解决非球面镜的脱膜问题。所制备的薄膜可以通过MIL-C-48497A标准中的附着力、湿度、中度摩擦等测试,并在3.7~4.8μm波段的平均透过率为99.12%,满足红外探测系统的指标要求。
For the purpose of achieving high-quality athermal imaging in the infrared detection system, an antireflection coating in the wave band of 3.7--4.8 μm was prepared on aspheric chalcogenide glass substrate. Adhesive layer material was selected in the experiment to improve the adhesion between the substrate and the coating. The finite element method and multi-physics simulation software were used to build a three-dimensional model that combined temperature field and thermal stress field. The stress distribution of aspheric film was analyzed. In view of the simulation results, the deposition process was optimized. The thermal stress of the chalcogenide glass substrate was reduced by temperature gradient heating and the stress of the deposited film was released by in-situ vacuum annealing so as to solve the film stripping problem of the aspheric mirror. The prepared film passed the tests of adhesion, humidity, and moderate friction of the MIL-C-48497 A standard and the average transmittance in the wave band of 3.7--4.8 μm was 99.12%, which means the prepared film met the index requirements of infrared detection system.
作者
付秀华
王海峰
张静
张功
任仲举
周笑平
杨飞
Fu Xiuhua;Wang Haifeng;Zhang Jing;Zhang Gong;Ren Zhongju;Zhou Xiaoping;Yang Fei(School of Opto-Electronic Engineering,Changchun University of Science and Technology,Changchun,Jilin 130022,China;School of Mechatronic Engineering,Changchun University of Science and Technology,Changchun,Jilin 130022,China;Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,Jilin 130033,China)
出处
《光学学报》
EI
CAS
CSCD
北大核心
2021年第20期230-239,共10页
Acta Optica Sinica
基金
国家重点研发计划(2017YEE0102900)
国家自然科学基金(11973040)。
关键词
薄膜
凹凸双面
有限元分析法
温度梯度烘烤法
真空原位退火法
thin films
double-sided concave-convex
finite element method
temperature gradient heating
in-situ vacuum annealing
