摘要
半导体制冷具有制冷效果好,便携带等特点,被广泛用于各个领域。为了使半导体制冷冷箱内温度场更快、更均匀地达到预期要求,通过ANSYS软件分别针对制冷片不同安装位置及冷端不同散热方式进行仿真模拟分析后发现,在相同的系统运行时间内强制对流时冷箱内温度比自然对流时低5 K左右,6种不同安装位置的最高温度分别为279.1 K、273 K、293.8 K、278.5 K、274.7 K、276 K,半导体制冷片安装在顶部时箱内箱内温度下降最快且温度梯度最小,箱内温度均匀性最佳。当半导体制冷箱时采取顶部安装制冷片和冷端强制散热结合的方式时,箱内温度下降更快,箱内温度分布更均匀。
Semiconductor refrigeration had the characteristics of good cooling effect and portable,and was widely used in various fields.In order to ensure that the temperature field in the semiconductor refrigeration cold box met the expected requirements faster and more uniformly,the ANSYS software was used to simulate and analyze the different installation positions of the cooling fins and the different heat dissipation methods of the cold end.It was found that,in the same system running time,the temperature in the cold box under forced convection was about 5 K lower than that under natural convection.The maximum temperature under the six different installation positions were 279.1 K,273 K,293.8 K,278.5 K,274.7 K,276 K.When the semiconductor refrigeration chip was installed on the top,the temperature in the box dropped the fastest and the temperature gradient was the smallest,and the temperature uniformity in the box was the best.
作者
王成刚
韩崇
郭佳欢
WANG Chenggang;HAN Chong;GUO Jiahuan
出处
《化工装备技术》
CAS
2021年第5期23-27,共5页
Chemical Equipment Technology
关键词
半导体制冷
ANSYS
对流方式
温度场
Semiconductor refrigeration
ANSYS
Convection mode
Temperature field
