摘要
本文设计了一种可用于通信机柜的半导体冷却装置,搭建了测试平台测试分析了散热量及冷却效率。根据测试结果分析了该半导体冷却装置在空气冷却工况下的散热量、冷却效率及影响因素,得到性能评价参数。结果表明:当环境平均温度为26℃且输入功率在200~360 W范围内时,装置的冷却效率先增大后减小,在输入功率为232 W时冷却效率达到最大值69.5%,制冷小室平均散热量为455.45 kJ,半导体冷却装置的冷却功率为151.8 W,且在相同条件下该装置可以带走5 kW通信机柜3.04%的热量。
In this study, a cabinet semiconductor cooling device was designed and its refrigerating capacity and cooling efficiency were tested using a test platform. The performance parameters were obtained according to test-based analyses of the refrigerating capacity, cooling efficiency, and other factors. According to the test results, for an average indoor temperature of 26 ℃ and 200-360 W input power, the cooling efficiency first increases and then decreases, reaching a maximum value of 69.5% when the input power is 232 W. Meanwhile, the average cooling capacity of the refrigeration chamber is 455.46 kJ and the power of the semiconductor cooling device is 151.8 W, which can remove 3.04% of the energy in a 5 kW communication cabinet.
作者
杨晚生
陈世林
毕崟
Yang Wansheng Chen Shilin Bi Yin(School of Civil and Transportation Engineering, Guangdong University of Technology, Guangzhou, 510006, China)
出处
《制冷学报》
CAS
CSCD
北大核心
2017年第5期82-92,共11页
Journal of Refrigeration
基金
广东省2015年公益项目(第一批)(2014A010106031)
广东省中国科学院全面战略合作专项资金竞争性分配项目(2013B091500094)
欧盟2020研究和创新基金项目(734340-DEW-COOL-4-CDC-MSCA-RIS)资助~~
关键词
通信机柜
半导体制冷
制冷效率
communications cabinet
semiconductor refrigeration
refrigerating efficiency
