摘要
以N-乙烯基咪唑、丙烯酸甲酯、丙烯酸乙酯为原料,使用可逆加成-断裂链转移技术(RAFT),N,N-二甲基甲酰胺(DMF)为溶剂,通过自由基共聚,制备了咪唑类潜伏型环氧树脂固化剂(VME)。对VME的分子结构进行了红外表征及分子量测试。将制备的VME和N-乙烯基咪唑共混,与环氧树脂E51组成潜伏性环氧树脂固化体系,并将其应用于电子灌封胶。对制备的环氧电子灌封胶的相关性能进行了测试。结果表明,当固化剂完全为VME时,环氧电子灌封胶性能优异,其适用期为96 d,拉伸强度达到28 MPa,体积电阻率为6.28×10^(13)Ω·m,热变形温度为155℃,其吸水率在室温条件下进行24 h浸泡之后能够达到0.076%。
Imidazoles latent epoxy resin curing agents(VME)was prepared by free radical copolymerization using N-vinylimidazole,methyl acrylate and ethyl acrylate as raw materials with the help of reversible addition-fragmentation chain transfer technology(RAFT)and N,N-dimethylformamide(DMF)as solvent.The molecular structure of VME was characterized by Fourier transform infrared spectroscopy(FTIR)and the molecular weight of VME was tested.Latent epoxy resin curing system was used in electronic potting,which was prepared by VME and N-vinylimidazole blended with epoxy resin E51.The related properties of the prepared epoxy electronic potting adhesive were tested,and the results show that the epoxy electronic potting adhesive has excellent performance when VME is used as a curing agent.Its pot life is 96 d,the tensile strength could reach 28 MPa,the volume resistivity is 6.28×10^(13)Ω·m,the heat distortion temperature is 155℃,and the water absorption rate is 0.076%after immersing for 24 h at room temperature.
作者
方瑞娜
姚新鼎
李延勋
裴东东
FANG Rui-na;YAO Xin-ding;LI Yan-xun;PEI Dong-dong(Yellow River Conservancy Technical Institute,Kaifeng 475004,China;Henan Engineering Technology Research Center of Green Coating Materials,Kaifeng 475004,China;Henan Institute of Engineering,Zhengzhou 450007,China)
出处
《塑料工业》
CAS
CSCD
北大核心
2021年第9期144-147,153,共5页
China Plastics Industry
基金
国家自然科学基金青年基金项目(51403053)
河南省教育厅科学技术研究重点项目(20A530004)
开封市科技攻关计划项目(1901021)。
关键词
咪唑
固化剂
潜伏性
环氧电子灌封胶
Imidazole
Curing Agent
Latent Performance
Epoxy Electronic Potting Glue
