摘要
介绍了电子产品环氧灌封材料的两种灌封工艺 :常态灌封和真空灌封 ;针对环氧树脂本身脆性大的缺点 ,详述了环氧灌封材料的增韧方法 ,主要包括端羧基聚丁二烯 -丙烯腈 (CTBN)增韧、复合弹性体微粒增韧、液晶环氧增韧、氰酸酯树脂增韧和纳米粒子增韧 ,同时对其增韧效果进行了评价 ;
Two kinds of the encapsulating processes of epoxy resin are introduced: normality encapsulating and vacuum encapsulating.Due to the brittleness of epoxy resin, several different toughening methods for epoxy resin materials are detailed, which includes CTBN, complexed elastic particles,LCPE, cyanate ester resin, nanocomposite particles toughening, and their effects are also reviewed.Lastly, three kinds of typical prescriptions of encapsulating materials and their properties are listed.
出处
《化工进展》
EI
CAS
CSCD
北大核心
2003年第10期1057-1060,共4页
Chemical Industry and Engineering Progress
