摘要
在高过载测试中,测试电路的灌封是一道关键的工艺,选用缓冲吸能效果好的灌封材料,采用合适的灌封工艺,是提高测试电路在高冲击和振动环境下工作可靠性的有效方法。从灌封材料的吸能机理、灌封材料固化应力产生机理等角度出发,论述了在进行灌封电路过程中需要注意的问题,确保灌封电路的整体性能和抗高过载性能。
The encapsulation of the test circuit is essential technics in high overload test.Choosing better encapsulating materials and using appropriate encapsulation technics are both effective methods to enhance the reliability of the test circuit under the high impact and vibrating environment.This paper discusses the problems which need to be noticed in the encapsulation process so as to guarantee the whole performance and the anti-high-overload performance of the encapsulation circuit.
出处
《机械工程与自动化》
2009年第5期90-91,94,共3页
Mechanical Engineering & Automation
基金
国家自然科学基金资助项目(50675213)
关键词
高过载
电子系统封装
封装应力
缓冲吸能
high overload
electronic system packaging
packaging stress
energy absorption
