摘要
Transfer printing is an emerging deterministic assembly technique for micro-fabrication and nano-fabrication,which enables the heterogeneous integration of classes of materials into desired functional layouts.It creates engineering opportunities in the area of flexible and stretchable inorganic electronics with equal performance to conventional wafer-based devices but the ability to be deformed like a rubber,where prefabricated inorganic semiconductor materials or devices on the donor wafer are required to be transfer-printed onto unconventional flexible substrates.This paper provides a brief review of recent advances on transfer printing techniques for flexible and stretchable inorganic electronics.The basic concept for each transfer printing technique is overviewed.The performances of these transfer printing techniques are summarized and compared followed by the discussions of perspectives and challenges for future developments and applications.
基金
the supports from the Zhejiang Provincial Natural Science Foundation of China(Grant No.LR15A020001)
the National Basic Research Program(Grant No.2015CB351901)
the National Natural Science Foundation of China(Grant Nos.11372272,11622221,and 11621062)
the Shenzhen Science and Technology Program(Grant No.JCY20170816172454095)
the Fundamental Research Funds for the Central Universities.
