摘要
激光技术以其自身在工作效率、加工精度及清洁性等方面的独特优势,在不同技术领域有广泛应用,其中激光微加工技术即可应用于集成电路的制造和封装。为深入探索这一应用的可行性、技术细节与后续发展潜力,详细介绍了激光微加工技术的主要特点,并结合集成电路产业的实际需要与特点,对激光微加工技术的实际应用情况展开分析并归纳技术要点,为激光微加工技术及电子制造业的发展提供参考。
Laser technology is widely used in different technical fields because of its unique advantages in working efficiency,machining accuracy and cleanness,among which laser micromachining technology can be applied to the manufacturing and packaging of integrated circuits.In order to explore the feasibility,technical details and subsequent development potential of the application,the main characteristics of laser micromachining technology are introduced in detail.Combined with the actual needs and characteristics of integrated circuit industry,the practical application of laser micromachining technology is analyzed and the technical points are summarized,which provides reference for the development of laser micromachining technology and electronic manufacturing industry.
作者
邹冰
孙楠楠
ZOU Bing;SUN Nannan(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110000,China)
出处
《微处理机》
2021年第2期62-64,共3页
Microprocessors
关键词
激光微加工
集成电路
制造业
Laser micromachining
Integrated circuit
Manufacturing industry
