摘要
钝化层作为芯片级集成电路产品的防护层,其质量和完整性对产品的可靠性起着决定性的影响,为探索其中的规律性,从钝化层失效机理出发,通过对具体质量案例的分析,介绍了镜检、能谱分析等失效分析手段。在案例中逐一排查钝化层下存在腐蚀性气体、积聚过量水汽、钝化层内积聚的热应力未能完全释放等失效因素,进而根据失效因素制定实验方案使产品质量问题复现,找出产品失效的原因。最终采用工艺优化的方式彻底解决了此类产品的钝化层质量问题,提高了集成电路产品的可靠性。
As the protective layer of chip-level integrated circuit products,the quality and integrity of passivation layer have a decisive influence on the reliability of products.In order to explore the regularity,starting from the failure mechanism of passivation layer,through the analysis of specific quality cases,failure analysis methods such as microscopic examination and energy spectrum analysis are introduced.In the case,the failure factors such as corrosive gas under passivation layer,excessive water vapor accumulation and thermal stress accumulated in passivation layer can not be completely released are investigated one by one.Then,according to the failure factors,the experimental scheme is made to make the product quality problems reappear and find out the reasons of product failure.Finally,the quality problem of passivation layer of the products is thoroughly solved by means of process optimization,and the reliability of integrated circuit products is improved.
作者
于姝莉
YU Shuli(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)
出处
《微处理机》
2020年第5期10-13,共4页
Microprocessors
关键词
钝化层
热应力
能谱分析
Passivation layer
Thermal stress
Spectrum analysis
