摘要
以甲基苯基二乙氧基硅烷(MePhSi(OEt)2)、二甲基二乙氧基硅烷(Me 2Si(OEt)2)、甲基乙烯基二乙氧基硅烷(MeViSi(OEt)2)、苯基三乙氧基硅烷(PhSi(OEt)3)及二甲基乙烯基乙氧基硅烷(Me 2ViSiOEt)封端剂为原料,盐酸催化下水解缩合,简单、高效制备高透明、高折光率LED封装苯基硅树脂,将所得甲基苯基乙烯基硅树脂与自制的甲基苯基含氢硅油按一定配比,在铂络合物催化下硫化成型,制成满足高折光率功率型LED封装材料.
Using methylphenyldiethoxysilane(MePhSi(OEt)2),dimethyldiethoxysilane(Me 2Si(OEt)2),methylvinyldiethoxysilane(MeViSi(OEt)2),phenyltriethoxysilane(PhSi(OEt)3)and dimethylvinylethoxysilane(Me 2ViSiOEt)as the raw materials,a novel LED packaging phenyl silicone resin with high refractive index and high transparent was prepared through hydrochloric acid catalyzed hydrolysis condensation.The methylphenyl vinyl silicone resin was vulcanized with self-made methylphenyl hydrogenated silicone oil in a certain ratio under the catalysis of platinum complex to form LED packaging materials with high refractive index.
作者
刘帅
彭艳芝
齐明
彭家建
刘勇
LIU Shuai;PENG Yanzhi;QI Ming;PENG Jiajian;LIU Yong(Foshan Polytechnic,Foshan 528137,China;Key Laboratory of Organosilicon Chemistry and Material Technology of Ministry of Education,Hangzhou Normal University,Hangzhou 311121,China;Foshan Mingchenda Organosilicon Co.,Ltd.,Foshan 528137,China)
出处
《杭州师范大学学报（自然科学版）》
CAS
2020年第5期460-463,510,共5页
Journal of Hangzhou Normal University(Natural Science Edition)
基金
浙江省自然科学基金项目(LY18B020012).
关键词
甲基苯基乙烯基硅树脂
LED封装
高折光率
methylphenyl vinyl silicone resin
LED packaging
high refractive index
