摘要
电路板是工业制造中的重要组成部分,为我国工业建设的蓬勃发展提供了坚实的基础,但是一旦电路板使用之后、废弃之后的处理手段也是值得深思和考虑的。电路板上有着大量的电子元器件,如何正确处理这些电子元器件成为了废弃电路板的重要思考方向,随着资源的不断开发和浪费,二次利用资源的回收势必会被提上日程。要想对电子元器件进行有效的加工利用,就必须要对废弃电路板上的电子元器件进行拆卸,因此废弃印刷电路板上的电子元器件拆卸技术成为了工艺建设中的重点研究策略。电路板的拆卸要求是十分严格的,包括两个阶段:热力解焊和机械拆除,因此必须要对废弃电路板的拆卸工艺技术现状进行分析并研究其拆卸机理,找到废弃印刷电路板上电子元器件拆卸新工艺技术。文章主要阐述了电路板的概念、种类以及电子元器件目前拆卸工艺技术的现状,并简要分析电子元器件拆卸工艺的机理。
Circuit board is an important part of industrial manufacturing,which provides a solid foundation for the vigorous development of industrial construction in our country,but once the circuit board is used and discarded,the treatment means are also worthy of deep consideration and consideration.There are a large number of electronic components on the circuit board.How to correctly deal with these electronic components has become an important thinking direction of the waste circuit board.With the continuous development and waste of resources,the recovery of secondary utilization resources is bound to be put on the agenda.In order to process and utilize the electronic components effectively,it is necessary to disassemble the electronic components on the waste circuit board.Therefore,the disassembly technology of electronic components on the waste printed circuit board has become the key research strategy in the process construction.The disassembly requirements of circuit board are very strict,including two stages:thermal soldering and mechanical removal,so it is necessary to analyze the present situation of disassembly technology of waste circuit board and study its disassembly mechanism and find out the new technology of disassembly of electronic components on waste printed circuit board.This paper mainly describes the concept and types of circuit board and the present situation of disassembly technology of electronic components,and briefly analyzes the mechanism of disassembly technology of electronic components.
出处
《科技创新与应用》
2019年第34期108-109,共2页
Technology Innovation and Application
关键词
废气电路板
电子元器件
拆卸工艺
机理
waste gas circuit board
electronic components
disassembly process
mechanism
