摘要
由于航天产品的成本高昂及高可靠性的要求,每次更换都要求不能对印制电路板及周围器件造成任何损伤,而元器件的可靠性解焊必然是各个环节中最重要、难度最大的一个环节。介绍了元器件可靠性解焊的必要性;阐述了影响可靠性解焊的主要因素,包括涂层去除、工艺选择、操作实施等。结合实际工程应用,对于元器件解焊的工艺选择及详细解焊方法进行了着重说明。
Due to the high cost and the requirement of high reliability of space products, repairing can＆#39;t cause any damage to the printed circuit board and the surrounding components, desoldering components reliably is the most important and difficult step. The necessity of desoldering component reliably is introduced. The main factors those affect desoldering component reliably are elaborated, including the coating removal and technology selection, operation and so on. The technology selection and detailed method of desoldering component reliably are highlighted based on application of practical engineering.
出处
《电子工艺技术》
2014年第5期268-270,297,共4页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:61036015)
关键词
航天元器件
涂层去除
解焊
Aerospace component
Coating removal
Desoldering
