摘要
与传统湿法腐蚀比较,干法刻蚀具有各向异性、对不同材料选择比差别较大、均匀性与重复性好、易于实现自动连续生产等优点。目前,刻蚀技术已经成为集成电路生产中的标准技术,干法刻蚀设备亦成为关键设备。本文对半导体生产中刻蚀的原理、分类,结合生产实际对刻蚀工艺进行了较系统的论述,并介绍了随着硅片尺寸的增大,工艺线条进入亚微米级时代,相应刻蚀设备的发展趋势。
Dry etching has the excellences as the list below:anisotropy,effective selectivity for different materials,uniformity,and easy to realize auto continuum operation.Now etching has be-come the standard technology,and etching equipment is the key equipment in IC production.This paper introduces the mechanism and classify of etching,etching process combining with the semiconductor production.The development of the etching equipment in big wafer and superfine line manufacturing is forecasted.
出处
《微纳电子技术》
CAS
2002年第11期41-44,共4页
Micronanoelectronic Technology
